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October 2009
General Information DDR3 SDRAM
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
96Ball FBGA for 1Gb E-die (x16)
A
B
C
D
E
F
G
H
M
N
7.50 ± 0.10
0.80 x 12 = 9.60
0.80 x 8 = 6.40
3.200.80
4.80
78 - ∅0.45 Solder ball
0.2 ABM
(Datum B)
(Datum A)
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
11.00 ± 0.10
J
K
L
0.80
0.80
(Post Reflow ∅0.05 ± 0.05)
(0.95)
(1.90)
Bottom
Top
Bottom
Top
#A1
7.50 ± 0.10
11.00 ± 0.10
0.10MAX
0.50 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
A
B
C
D
E
F
G
H
J
L
M
N
P
R
T
7.50 ± 0.10
6.00
(Datum B)
(Datum A)
#A1 INDEX MARK
13.30 ± 0.10
K
0.80 x 15 = 12.00
B
A
0.80
0.40
96 - ∅0.45 Solder ball
0.2 ABM
MOLDING AREA
(Post Reflow ∅0.05 ± 0.05)
(0.95)
(1.90)
#A1
7.50 ± 0.10
13.30 ± 0.10
0.10MAX
0.50 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
876543219
0.80 x 8 = 6.40
3.200.80 1.60
876543219