Samsung DDR3 Computer Hardware User Manual


 
October 2009
General Information DDR3 SDRAM
4.3 204Pin DDR3 SoDIMM (1.5V Product)
204Pin DDR3 SODIMM
Org. Density Part Number Speed Raw Card Composition
Comp.
Version
Internal
Banks
Rank PKG Height Avail. Note
128Mx 64 1GB
M471B2874DZ1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb D-die 8 2
96 + 4 ball
FBGA
30mm Now
M471B2873EH1 CF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1
78 ball
FBGA
M471B2874EH1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball
M471B2873FHS CF8/H9 B(1Rx8) 64M x 16 * 8 pcs 1Gb F-die 8 1
78 ball
FBGA
256Mx 64 2GB
M471B5673DZ1 CF8/H9
F(2Rx8)
128M x 8 * 16 pcs 1Gb D-die
82
78 + 4 ball
FBGA
30mm Now
M471B5673EH1 CF8/H9 128M x 8 * 16 pcs 1Gb E-die
78 ball
FBGA
M471B5673FH0 CF8/H9 128M x 8 * 16 pcs 1Gb F-die
M471B5773CHS CF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1
512Mx 64 4GB
M471B5273BH1 CF8/H9
F(2Rx8)
256M x 8 * 16 pcs 2Gb B-die
82
78 ball
FBGA
30mm Now
M471B5273CH0 CF8/H9 256M x 8 * 16 pcs 2Gb C-die
4.4 204Pin DDR3 SoDIMM (1.35V Product)
* Note : 1.35V product is 1.5V operatable.
204Pin DDR3 SODIMM
Org. Density Part Number Speed Raw Card Composition
Comp.
Version
Internal
Banks
Rank PKG Height Avail. Note
128Mx 64 1GB
M471B2873EH1 YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 8 1
78 ball
FBGA
30mm NowM471B2874EH1 YF8/H9 A(1Rx16) 64M x 16 * 8 pcs 1Gb E-die 8 2 96 ball
M471B2873FHS YF8/H9 B(1Rx8) 128M x 8 * 8 pcs 1Gb F-die 8 1
78 ball
FBGA
256Mx 64 2GB
M471B5673EH1 YF8/H9
F(2Rx8)
128M x 8 * 16 pcs 1Gb E-die
82
78 ball
FBGA
30mm NowM471B5673FH0 YF8/H9 128M x 8 * 16 pcs 1Gb F-die
M471B5773CHS YF8/H9 B(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1
512Mx 64 4GB
M471B5273BH1 YF8/H9
F(2Rx8)
256M x 8 * 16 pcs 2Gb B-die
82
78 ball
FBGA
30mm Now
M471B5273CH0 YF8/H9 256M x 8 * 16 pcs 2Gb C-die