Samsung DDR3 Computer Hardware User Manual


 
October 2009
General Information DDR3 SDRAM
4.6 240Pin DDR3 Registered DIMM (1.35V Product)
* Note : 1.35V product is 1.5V operatable.
240Pin DDR3 Registered DIMM
Org. Density Part Number Speed Raw Card Composition
Comp.
Version
Internal
Banks
Rank PKG Height Avail. Note
128Mx 72 1GB
M393B2873EH1 YF8/H9
A(1Rx8)
128M x 8 * 9 pcs 1Gb E-die
81
78 ball
FBGA
30mm Now
M393B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die
256Mx 72 2GB
M393B5673EH1 YF8/H9
B(2Rx8)
128M x 8 * 18 pcs 1Gb E-die
82
78 ball
FBGA
30mm Now
M393B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die
M393B5670EH1 YF8/H9
C(1Rx4)
256M x 4 * 18 pcs 1Gb E-die
81M393B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die
M393B5773CH0 YF8/H9 A(1Rx8) 512M x 4 * 9 pcs 2Gb C-die
512Mx 72 4GB
M393B5173EH1 YF7/F8
H(4Rx8)
128M x 8 * 36 pcs 1Gb E-die
84
78 ball
FBGA
30mm Now
M393B5173FH0 YF7/F8 128M x 8 * 36 pcs 1Gb F-die
M393B5170EH1 YF8/H9
E(2Rx4)
256M x 4 * 36 pcs 1Gb E-die
82
M393B5170FH0 YF8/H9 256M x 4 * 36 pcs 1Gb F-die
M393B5273BH1 YF8/H9
B(2Rx8)
256M x 8 * 18 pcs 2Gb B-die
82
M393B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die
M393B5270BH1 YF8/H9
C(1Rx4)
512M x 4 * 18 pcs 2Gb B-die
81
M393B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die
1Gx 72 8GB
M393B1G70EM1 YF7/F8
F(4Rx4)
DDP
512M
x 4 * 36 pcs 1Gb E-die
84
78 ball
FBGA
30mm
Now
M393B1G70FM0 YF7/F8
DDP
512M
x 4 * 36 pcs 1Gb F-die Nov. ’09
M393B1K73BH1 YF7/F8
H(4Rx8)
256M x 8 * 36 pcs 2Gb B-die
84
Now
M393B1K73CH0 YF7/F8 256M x 8 * 36 pcs 2Gb C-die
M393B1K70BH1 YF8/H9
E(2Rx4)
512M x 4 * 36 pcs 2Gb B-die
82
M393B1K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die
2Gx 72 16GB
M393B2K70BM1 YF7/F8
F(4Rx4)
DDP
1G
x 4 * 36 pcs 2Gb B-die
84
78 ball
FBGA
30mm
Now
M393B2K70CM0 YF7/F8
DDP
1G
x 4 * 36 pcs 2Gb C-die Nov. ’09