Filter
Top Products
Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support
Datasheet
Revision 1.0 (05-28-09) 66 SMSC LAN8720/LAN8720i
DATASHEET
Chapter 7 DC Electrical Characteristics
7.1 DC Characteristics
7.1.1 Maximum Guaranteed Ratings
Stresses beyond those listed in may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
7.1.1.1 Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and
manufacturing, and is done without power applied to the IC. To pass the test, the device must have
Table 7.1 Maximum Conditions
PARAMETER CONDITIONS MIN TYP MAX UNITS COMMENT
VDD1A,
VDD2A,
VDDIO
Power pins to all other pins. -0.5 +3.6 V
Digital IO To VSS ground -0.5 +3.6 V Table 7.6
VSS VSS to all other pins -0.5 +0.5 V
Junction to
Ambient (θ
JA
)
Thermal vias per Layout
Guidelines.
59.8 °C/W
Junction to
Case (θ
JC
)
12.6 °C/W
Operating
Temperature
LAN8720-AEZG 0 +85
o
C Extended commercial
temperature components.
Operating
Temperature
LAN8720i-AEZG -40 +85
o
C Industrial temperature
components.
Storage
Temperature
-55 +150
o
C
Table 7.2 ESD and LATCH-UP Performance
PARAMETER CONDITIONS MIN TYP MAX UNITS COMMENTS
ESD PERFORMANCE
All Pins Human Body Model ±5 kV Device
System IED61000-4-2 Contact Discharge ±15 kV 3rd party system test
System IEC61000-4-2 Air-gap Discharge ±15 kV 3rd party system test
LATCH-UP PERFORMANCE
All Pins EIA/JESD 78, Class II 150 mA