SMSC RMII 10/100 Switch User Manual


 
Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support
Datasheet
SMSC LAN8720/LAN8720i 67 Revision 1.0 (05-28-09)
DATASHEET
no change in operation or performance due to the event. All pins on the LAN8720 provide +/-5kV HBM
protection.
7.1.1.2 IEC61000-4-2 Performance
The IEC61000-4-2 ESD specification is an international standard that addresses system-level immunity
to ESD strikes while the end equipment is operational. In contrast, the HBM ESD tests are performed
at the device level with the device powered down.
SMSC contracts with Independent laboratories to test the LAN8720 to IEC61000-4-2 in a working
system. Reports are available upon request. Please contact your SMSC representative, and request
information on 3rd party ESD test results. The reports show that systems designed with the LAN8720
can safely dissipate ±15kV air discharges and ±15kV contact discharges per the IEC61000-4-2
specification without additional board level protection.
In addition to defining the ESD tests, IEC 61000-4-2 also categorizes the impact to equipment
operation when the strike occurs (ESD Result Classification). The LAN8720 maintains an ESD Result
Classification 1 or 2 when subjected to an IEC 61000-4-2 (level 4) ESD strike.
Both air discharge and contact discharge test techniques for applying stress conditions are defined by
the IEC61000-4-2 ESD document.
AIR DISCHARGE
To perform this test, a charged electrode is moved close to the system being tested until a spark is
generated. This test is difficult to reproduce because the discharge is influenced by such factors as
humidity, the speed of approach of the electrode, and construction of the test equipment.
CONTACT DISCHARGE
The uncharged electrode first contacts the pin to prepare this test, and then the probe tip is energized.
This yields more repeatable results, and is the preferred test method. The independent test laboratories
contracted by SMSC provide test results for both types of discharge methods.
7.1.2 Operating Conditions
7.1.3 Power Consumption
7.1.3.1 Power Consumption Device Only REF_CLK IN Mode
Power measurements taken over the operating conditions specified. See Section 5.3.5 for a description
of the power down modes. For more information on REF_CLK IN Mode, see Section 4.7.1.
Table 7.3 Recommended Operating Conditions
PARAMETER CONDITIONS MIN TYP MAX UNITS COMMENT
VDD1A, VDD2A To VSS ground 3.0 3.3 3.6 V
VDDIO To VSS ground 1.6 3.3 3.6 V
Input Voltage on
Digital Pins
0.0 VDDIO V
Voltage on Analog I/O
pins (RXP, RXN)
0.0 +3.6V V
Ambient Temperature T
A
LAN8720-AEZG 0 +85
o
C For Extended Commercial
Temperature
T
A
LAN8720i-AEZG -40 +85
o
C For Industrial Temperature