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HP BladeSystem c3000 Enclosure
technology brief, 2nd edition
Abstract.............................................................................................................................................. 3
Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 3
Managing the c3000 enclosure ............................................................................................................ 5
Onboard Administrator..................................................................................................................... 5
Detecting component insertion and removal..................................................................................... 5
Identifying components ................................................................................................................. 6
Managing power and cooling ....................................................................................................... 6
Controlling components................................................................................................................. 6
User interfaces for Onboard Administrator ...................................................................................... 8
Security....................................................................................................................................... 8
Role-based user accounts............................................................................................................... 8
Integrated Lights-Out 2 for c-Class server blades .................................................................................. 9
Insight Display................................................................................................................................. 9
Onboard Administrator cabling....................................................................................................... 10
Enclosure link cabling..................................................................................................................... 11
Enclosure-based DVD ROM................................................................................................................. 12
Enclosure KVM Module ...................................................................................................................... 12
Interconnect options and infrastructure.................................................................................................. 13
Interconnect modules...................................................................................................................... 15
Server blades ................................................................................................................................16
Storage and other option blades...................................................................................................... 16
Mezzanine cards........................................................................................................................... 17
Virtual Connect.............................................................................................................................. 18
Fabric connectivity and port mapping............................................................................................... 18
c3000 bay-to- bay crosslinks........................................................................................................... 21
Device bay crosslinks.................................................................................................................. 21
Interconnect bay crosslinks .......................................................................................................... 22
HP Thermal Logic technologies............................................................................................................ 22
Active Cool fans ............................................................................................................................ 23
HP PARSEC architecture.................................................................................................................. 24
Parallel...................................................................................................................................... 24
Redundant and scalable.............................................................................................................. 25
Thermal Logic for the server blade.................................................................................................... 26
Power supplies and enclosure power subsystem................................................................................. 27
Pooled power configuration and power redundancy options ........................................................... 29
Dynamic Power Saver mode........................................................................................................ 30
HP Power Regulator for ProLiant................................................................................................... 31
Power Capping for each server blade........................................................................................... 31
Power meter .............................................................................................................................. 31