Toshiba L645D Personal Computer User Manual


 
Chapter 4 Replacement Procedures
Satellite L640/L645, Satellite Pro L640/Pro L645 Maintenance Manual (960-Q08)
Chapter 4 Contents
4.1 Overview....................................................................................................................... 1
Safety Precautions ................................................................................................... 2
Before You Begin ................................................................................................... 3
Disassembly Procedure........................................................................................... 4
Assembly Procedure ............................................................................................... 5
Tools and Equipment .............................................................................................. 5
Screw Tightening Torque ....................................................................................... 6
Grip Color ............................................................................................................... 6
Screw Notation........................................................................................................ 7
4.2 Battery pack .................................................................................................................. 8
4.3 HDD/SSD ................................................................................................................... 11
4.4 Memory Module ......................................................................................................... 14
4.5 Keyboard..................................................................................................................... 17
4.6 Wireless LAN Card..................................................................................................... 20
4.7 3G Module Card ......................................................................................................... 23
4.8 Display Assembly ....................................................................................................... 26
4.9 Top Cover Assembly .................................................................................................. 33
4.10 Touch pad.................................................................................................................... 36
4.11 I/O board ..................................................................................................................... 39
4.12 Mother Board.............................................................................................................. 41
4.13 CPU Heat Sink............................................................................................................ 46
4.14 LCD unit ..................................................................................................................... 48
4.15 Web Camera Module .................................................................................................. 52
4.16 Application for Thermal pad and grease on CPU, NB, V-ram, Chock and VGA.…..55
4.17 Speaker Box………………………………………………………………………….57
4.18 Optical Disc Drive and ODD Bezel………………………………………………….60
4.19 BT Module………………………...…………………………………………………64
4.20 Modem……………………………………………………………………………….66