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CY7C63413C
CY7C63513C
CY7C63613C
Document #: 38-08027 Rev. *B Page 31 of 32
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
All products and company names mentioned in this document may be the trademarks of their respective holders.
Package Diagrams (continued)
PIN 1 ID
SEATINGPLANE
0.597[15.163]
0.615[15.621]
112
13 24
*
*
*
0.291[7.391]
0.300[7.620]
0.394[10.007]
0.419[10.642]
0.050[1.270]
TYP.
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
0.0091[0.231]
0.0125[0.317]
0.015[0.381]
0.050[1.270]
0.013[0.330]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.004[0.101]
PART #
S24.3 STANDARD PKG.
SZ24.3 LEAD FREEPKG.
MIN.
MAX.
NOTE :
1. JEDEC STDREF MO-119
2. BODY LENGTHDIMENSION DOES NOT INCLUDEMOLD PROTRUSION/END FLASH,BUT
MOLD PROTRUSION/END FLASH SHALL NOTEXCEED 0.010 in (0.254mm) PER SIDE
3. DIMENSIONS ININCHES
4. PACKAGE WEIGHT0.65gms
DOES INCLUDE MOLDMISMATCH AND ARE MEASUREDAT THE MOLD PARTINGLINE.
51-85025-*C
24-Lead (300-Mil) SOIC S24.3/SZ24.3
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