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Document Number: 3-12029 Rev. *E Page 29 of 31
Figure 18. 28-Pin (210-Mil) SSOP
Thermal Impedances Capacitance on Crystal Pins
Solder Reflow Peak Temperature
The following table lists the minimum solder reflow peak temperature to achieve good solderability.
51-85079 *C
Table 29. Thermal Impedances per Package
Package Typical θ
JA
*
20 SSOP 117
o
C/W
28 SSOP 101
o
C/W
* T
J
= T
A
+ POWER x θ
JA
Table 30. Typical Package Capacitance on Crystal Pins
Package Package Capacitance
20 SSOP 2.6 pF
28 SSOP 2.8 pF
Table 31. Solder Reflow Peak Temperature
Package Minimum Peak Temperature* Maximum Peak Temperature
20 SSOP 240
o
C 260
o
C
28 SSOP 240
o
C 260
o
C
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
o
C with
Sn-Pb or 245 ± 5
o
C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
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