HP (Hewlett-Packard) 4410T Laptop User Manual


 
Removal and replacement procedures
Maintenance and Service Guide 4–31
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time
the heat sink is removed:
Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
Replacement thermal material is included with all system board, heat sink, and processor spare part kits.
When replacing the heat sink, be sure to remove the fan from the defective heat sink and install it on the
replacement heat sink. See “Fan” on page 4-32 for fan removal instructions.
Reverse this procedure to install the heat sink.