HP (Hewlett-Packard) B9P54UA Laptop User Manual


 
10.
Remove the fan/heat sink assembly (4) by lifting straight up.
Each time the fan/heat sink assembly is removed, the thermal material must be thoroughly cleaned from
the system board at locations (1) and (2), from the fan/heat sink assembly at locations (3) and (5),
and from the processor (4). Thermal pads and thermal paste must be installed on all surfaces before
the fan/heat sink assembly is reinstalled.
NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with Intel processors.
Each time the fan/heat sink assembly is removed, the thermal material must be thoroughly cleaned from
the system board at locations (1), (2), and (4), from the fan/heat sink assembly at locations (3), (5),
and (7), and from the processor (6). Thermal pads and thermal paste must be installed on all surfaces
before the fan/heat sink assembly is reinstalled.
The following illustration shows the locations for thermal material on systems with AMD processors.
Component replacement procedures
75