HP (Hewlett-Packard) DM3 Laptop User Manual


 
Heat sink
NOTE: The processor is soldered onto the system board. Thermal grease has been applied between
the heat sink and the processor, chipset, and graphics chipset.
Description Spare part
number
Heat sink for use only on computer models equipped with a graphics subsystem with discrete memory 581187-001
Heat sink for use only on computer models equipped with a graphics subsystem with UMA memory 581186-001
Before removing the heat sink, follow these steps:
1.
Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2.
Disconnect all external devices connected to the computer.
3.
Disconnect the power from the computer by first unplugging the power cord from the AC outlet,
and then unplugging the AC adapter from the computer.
4.
Remove the battery (see
Battery on page 36).
5.
Remove the following components:
a.
Hard drive (see
Hard drive on page 38)
b.
Memory/wireless module compartment cover (see
WLAN module on page 43
c.
Keyboard (see
Keyboard on page 50)
d.
Display assembly (see
Display assembly on page 57)
e.
Top cover (see
Top cover on page 53)
f.
System board (see
System board on page 67)
Remove the heat sink:
1.
Loosen the four captive Phillips 2.0×8.0 screws 1 in the order sequence noted on the heat sink.
2.
Remove the five Phillips 2.0×4.0 screws 2 holding the heat sink to the system board.
Component replacement procedures
73