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4.
Remove the processor fan/heat sink assembly (4).
NOTE: Due to the adhesive quality of the thermal material located between the processor fan/
heat sink assembly and system board components, it may be necessary to move the processor
fan/heat sink assembly from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the processor fan/heat
sink assembly and the system board each time the processor fan/heat sink assembly is removed.
Thermal paste is used on the processor (1) and the processor fan/heat sink assembly section (2) that
services it. Replacement thermal material is included with all system board, processor, and fan/heat
sink assembly spare part kits.
Reverse this procedure to install the fan.
52 Chapter 4 Removal and replacement procedures