HP (Hewlett-Packard) sx2000 Computer Hardware User Manual


 
Index
A
ac power verification
4-wire PDCA, 84
5-wire PDCA, 84
AC0 Present LED, 98, 180
AC1 Present LED, 98, 180
acoustic noise specifications
sound power level, 56
sound pressure level, 56
air handling spaces, 20
American Society of Heating, Refrigerating and
Air-Conditioning Engineers, (see ASHRAE)
ASHRAE Class 1, 49, 50, 57
attention LED, 179
B
bezel
attaching front bezel, 82
attaching rear bezel, 81
attaching side bezels, 75
blower bezels (See also "bezel"), 75
blower housings
installing, 72
unpacking, 72
booting
checking cabinet power status, 107
checking installed cell slot locations, 107
invoking the EFI shell, 105
output from the EFI shell, 105
system verification, 101
to the EFI boot manager menu, 104
viewing UGUY LED status, 107
BPS, 19
bulk power supply, (see BPS)
C
cabinet ID description, 29
cabinet unpacking, 63
cable groomer, 92
cables
clock description, 44
connecting I/O, 91
e-Link description, 42
external e-Link description, 42
labeling I/O, 91
m-Link description, 42
routing I/O, 91
cell board
cell controller, 30
cell map, 34
coherency controller diagram, 35
DIMM architecture and description, 33
DIMM mixing rules, 33, 48
DRAM erasure, 35
ejectors, 110
ID description, 29
link interleaving, 35
major component locations, 30
memory bank attribute table, 34
memory error protection, 35
memory interconnect, 33
memory interleaving, 34
memory shown on, 32
memory system, 32
OL*, 37
platform dependent hardware, 36
processor dependent code, 36
processor dependent table, 36
reset signals, 37
verifying presence of, 108
CFM rating, 56
checklist
repackaging, 71
circuit board dimensions and weight, 49
circuit breaker sizing
3-phase, 4-wire input, 51
3-phase, 5-wire input, 51
nuisance tripping, 51
claims procedures, 62
clock and utilities board, (see CLU)
clock cable description, 44
CLU
general description, 23
I/O power board sensor monitor, 21
information gathered by, 23
status seen in window, 108
system clock source location, 22
UGUY location, 22
communications interference, 59
compact flash
general description, 25
parameters stored in, 25
computer room layout plan, 185
connecting I/O cables, 91
cooling system
blowers, 21
I/O fans, 21
inlet air sensor location, 21
crossbar chip, (see XBC)
customer LAN, 99
customer signoff, 112
D
damage
returning equipment, 71
shipping containers, 61
dimensions and weights, 49
DIMM
mixing rules, 33, 48
discharge
electrostatic, 59
197