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Intel Desktop Board D810EMO/MO810E Technical Product Specification
56
Table 37 provides maximum component case temperatures for board components that could be
sensitive to thermal changes. Case temperatures could be affected by the operating temperature,
current load, or operating frequency. Maximum case temperatures are important when considering
proper airflow to cool the board.
Table 37. Thermal Considerations for Components
Component Maximum Case Temperature
Intel Celeron Processor
366 MHz 85 °C
400 MHz 85 °C
433 MHz 85 °C
466 MHz 70 °C
500 MHz 70 °C
533 MHz 70 °C
Intel Pentium III Processor
500E MHz 85 °C
550E MHz 85 °C
600E MHz 85 °C
600EB MHz 85 °C
Intel 82810E DC-133 GMCH 70 °C
Intel 82801AA ICH 100 °C
Creative ES1373D 70 °C
CAUTION
The voltage regulator area can reach a temperature of up to 85
o
C in an open chassis. Ensure that
there is proper airflow to this area of the board. Failure to do so may result in damage to the
voltage regulator circuit. System integrators should ensure that proper airflow is maintained in
the voltage regulator circuit (item E in Figure 10). Components in this area could be damaged
without adequate airflow.
2.13 Reliability
The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 55 ºC.
Board MTBF: 330,526 hours