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Intel® Integrated RAID Module SROMBSASMR (AXXROMBSASMR) Technical Product Specification Table of Contents
Table of Contents
1. Introduction ..........................................................................................................................1
1.1 Product Overview ....................................................................................................1
1.2 Operating System Support ......................................................................................1
1.3 Features List............................................................................................................2
2. Hardware...............................................................................................................................4
2.1 Block Diagram .........................................................................................................4
2.2 Module Layout .........................................................................................................5
2.3 Major Components ..................................................................................................5
2.3.1 LSI* 1078 SAS ROC................................................................................................5
2.3.2 Flash ROM...............................................................................................................6
2.3.3 Boot Strap ROM (SEEPROM) .................................................................................6
2.3.4 NVSRAM .................................................................................................................6
2.3.5 SDRAM (Cache) ......................................................................................................6
2.3.6 Diagnostics ..............................................................................................................7
2.3.7 SAS / SATA Connectors..........................................................................................7
2.3.8 Host Board Interface................................................................................................8
2.3.9 BBU Interface ........................................................................................................10
2.3.10 Jumpers and Connectors.......................................................................................12
2.4 Hardware Architectural Features ...........................................................................12
2.5 Electrical Characteristics .......................................................................................13
2.6 Environmental Specifications.................................................................................13
2.7 Supported Device Technology...............................................................................14
2.7.1 Support for Hard Disk Drive Devices .....................................................................14
2.7.2 SAS Expander Support.......................................................................................... 14
2.7.3 Support for Non-Hard Disk Drive Devices ............................................................. 14
2.7.4 Enclosure Management Support ...........................................................................14
3. Software ..............................................................................................................................15
3.1 Common Layers ....................................................................................................16
3.1.1 Firmware................................................................................................................16
3.1.2 API.........................................................................................................................16
3.1.3 Operating System Driver .......................................................................................17
Revision 1.2
Intel order number E59029-003
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