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Tegra 200 Series Developer Board User Guide
DG-04927-001_v01 Advance Information – Subject to Change 38
NVIDIA CONFIDENTIAL
5.0 THERMAL
5.1 Major Component Thermal Specifications
Most of the major components used in Tegra 200 series Developer Board are listed in Table 39 along with the temperature
range they are able to operate across.
Note:
The specifications noted in Table 16 may change and other versions with wider or
narrower temperature ranges may be available from the manufacturers
Any design using these components must ensure each of these devices do not exceed the maximum temperature. This may
require careful board and mechanical design practices to accommodate various contributors to heat generation.
Table 15. Major Component Thermal Specifications
Device Definition Min Max Units Notes
Overall System Operating temperature (ambient) 0 50 °C 1
Tegra 250 Operating Case Temperature -25 85 °C
Hynix HY5PS1G831CLFP DDR2 Operating Case Temperature -30 85 °C
Hynix HY27UF084G2B-TPCB NAND Operating Case Temperature 0 70 °C
Wolfson WM8903 Audio Codec Operating Case Temperature -40 85 °C
TI TPS658621AZGUR PMU Operating Case temperature -40 85 °C
SMSC MEC1308 Embedded Controller Operating Case Temperature 0 70 °C
SMSC LAN9514 USB Hub and Ethernet Operating Case Temperature 0 70 °C
SMSC USB3315 ULPI Phy Operating Case Temperature -40 85 °C
TI SN75LVDS83B LVDS Transmitter Operating Case Temperature -10 70 °C
Note:
1. Design specific. Rating shown is typical for many mobile computing designs
5.2 Thermal Considerations for Components
Figure 27 and Figure 28 show the top and bottom of the Tegra 200 Series Developer Board. The components that either
generate heat, or may be very sensitive to temperature are highlighted with different colors:
Green: Adversely sensitive to heat
Yellow: Mild contributor to heat generation
Lt Orange: Medium contributor to heat generation
Dark Orange: Significant contributor to heat generation
The Green coded devices may be significantly affected by temperature. Typically these have more analog circuitry and may not
perform as well hot such as the Camera Module. The other highlighted parts contribute additional heat to the system which can
be problematic to deal with in an enclosed mobile device.