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Tegra 200 Series Developer Board User Guide
DG-04927-001_v01 Advance Information – Subject to Change 40
NVIDIA CONFIDENTIAL
The Tegra 200 Series Developer Board does not represent an actual layout for use in a Smartbook design. It does show the
various components typically found in a Smartbook and aids in describing some useful thermal guidelines:
Keep hotter or more sensitive components from being in close proximity to each other
- This may include keeping them from being directly opposite each other on each side of the PCB. The exception is
the DDR2 devices which need to be located opposite each other in an 8 device design for signal integrity reasons.
Provide airflow to help remove trapped heat for either side of the PCB where hot components are located
- Possibly providing extra room (x, y and z) around hot components to help with airflow
Use some type of metal heat spreader to help dissipate some of the heat from especially hot components.
- This could be an additional piece of metal, or having the case (bottom of PCB) or keyboard plate (top of PCB)
contact the hotter components.
Figure 29. Considerations for resolving for thermal “hot spots”