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4-Port USB 2.0 Controller
Datasheet
SMSC USB20H04 Page 35 Revision 1.63 (03-30-07)
DATASHEET
Chapter 11 Package Outline
Figure 11.1 - 64 Pin TQFP Package Outline, 10 x 10 x 1.4 Body, 2 MM Footprint
Table 11.1 - 64 Pin TQFP Package Parameters
MIN NOMINAL MAX REMARKS
A
~ ~ 1.60 Overall Package Height
A1
0.05 ~ 0.15 Standoff
A2
1.35 ~ 1.45 Bod
y
Thickness
D
11.80 ~ 12.20 X Span
D1
9.80 ~ 10.20 X bod
y
Size
E
11.80 ~ 12.20 Y Span
E1
9.80 ~ 10.20 Y bod
y
Size
H
0.09 ~ 0.20 Lead Frame Thickness
L
0.45 0.60 0.75 Lead Foot Len
g
th
L1
~ 1.00 ~ Lead Len
g
th
e
0.50 Basic Lead Pitch
θ
0
o
~ 7
o
Lead Foot Angle
W
0.17 0.22 0.27 Lead Width
R1
0.08 ~ ~ Lead Shoulder Radius
R2
0.08 ~ 0.20 Lead Foot Radius
ccc
~ ~ 0.08 Coplanarit
y
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.