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CXP854P60
Package Outline Unit: mm
64PIN SDIP (PLASTIC)
MIN
0.5
MIN
3.0
4.75 – 0.1
0.9 ± 0.15
0.5 ± 0.1
0.25 – 0.05
+ 0.1
17.1 – 0.1
19.05
132
33
64
1.778
57.6 – 0.1
+ 0.4
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
42/COPPER ALLOY
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
P-SDIP64-17.1x57.6-1.778
SOLDER PLATING
8.6g
+ 0.3
+ 0.3
0˚ to 15˚
PACKAGE STRUCTURE
64PIN SDIP (PLASTIC)
MIN
0.5
MIN
3.0
4.75 – 0.1
0.9 ± 0.15
0.5 ± 0.1
0.25 – 0.05
+ 0.1
17.1 – 0.1
19.05
132
33
64
1.778
57.6 – 0.1
+ 0.4
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
42/COPPER ALLOY
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
P-SDIP64-17.1x57.6-1.778
SOLDER PLATING
8.6g
+ 0.3
+ 0.3
0˚ to 15˚
PACKAGE STRUCTURE
LEAD SPECIFICATIONS
ITEM
LEAD MATERIAL ALLOY 42
LEAD TREATMENT Sn-Bi 2.5%
LEAD TREATMENT THICKNESS 5-18µm
SPEC.