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Data Sheet: Maxeta
TM
iFA Series
©2002-2006 TDK Innoveta Inc.
iFA 28V 600W Advance Datasheet 8/3/2006
℡
(
877
)
498-0099
12/19
Heat transfer by convection can be
enhanced by increasing the airflow rate that
the power module experiences. The
maximum output current of the power
module is a function of ambient temperature
(T
AMB
) and airflow rate as shown in the
thermal performance figures in the Thermal
Performance section. The curves in the
figures are shown for natural convection
through 3 m/s (600 ft/min). The data for the
natural convection condition has been
collected at 0.3 m/s (60 ft/min) of airflow,
which is the typical airflow generated by
other heat dissipating components in many
of the systems that these types of modules
are used in. In the final system
configurations, the airflow rate for the natural
convection condition can vary due to
temperature gradients from other heat
dissipating components.
Heatsink Usage: For applications with
demanding environmental requirements,
such as higher ambient temperatures or
higher power dissipation, the thermal
performance of the power module can be
improved by attaching a heatsink or cold
plate. The iFA platform is designed with a
base plate with four M3 X 0.5 through-
threaded mounting fillings for attaching a
heatsink or cold plate. The addition of a
heatsink can reduce the airflow requirement,
ensure consistent operation and extended
reliability of the system. With improved
thermal performance, more power can be
delivered at a given environmental condition.
Standard heatsink kits are available from
Innoveta Technologies for vertical module
mounting in two different orientations
(longitudinal – perpendicular to the direction
of the pins and transverse – parallel to the
direction of the pins) as shown in the
Heatsink Offering section. The heatsink kit
contains four M3 x 0.5 steel mounting
screws and a precut thermal interface pad
for improved thermal resistance between the
power module and the heatsink. The
screws should be installed using a torque-
limiting driver set between 0.35-0.55 Nm (3-
5 in-lbs).
During heatsink assembly, the base-plate to
heatsink interface must be carefully
managed. A thermal pad may be required to
reduce mechanical-assembly-related
stresses and improve the thermal
connection. Please contact Innoveta
Engineering for recommendation on this
subject.
The system designer must use an accurate
estimate or actual measure of the internal
airflow rate and temperature when doing the
heatsink thermal analysis. For each
application, a review of the heatsink fin
orientation should be completed to verify
proper fin alignment with airflow direction to
maximize the heatsink effectiveness. For
Innoveta standard heatsinks, contact
Innoveta Technologies for latest
performance data.