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16 Chapter 1
Hardware Specifications and Configurations
Processor
Processor Specifications
Item Specification
CPU Manufacturer Intel
CPU package Micro-FCPGA packaging, 479-pin
Core Logic • NB Chipset Intel CS GM45NB / PM45NB
• SB Chipset Intel CS ICH9M
Chipset • ENE KB926 for Keyboard Controller, Battery management
Unit, and RTC.
• Integrated VGA solution for Intel 945GSE.
• Realtek ALC272X-GR for High Definition Audio Codec.
• Atheros AR8114A for 10/100 LAN
Features • Dual-core processor for mobile with enhanced performance
• Supports Intel® architecture with Intel® Wide Dynamic
Execution
• Supports L1 cache-to-cache (C2C) transfer
• On-die, primary 32-kB instruction cache and 32-kB write-back
data cache in each core
• The Penryn processor in XE, SV and LV have an On-die, up to
6-MB second-level shared cache with Advanced Transfer
Cache architecture
• The Penryn processor in ULV have an On-die, up to 3-MB
second-level shared cache with Advanced Transfer Cache
architecture
• Streaming SIMD extensions 2 (SSE2), streaming SIMD
extensions 3 (SSE3), supplemental streaming SIMD
extensions 3 (SSSE3) and SSE4.1 instruction sets
• The Penryn processor in XE, SV and LV are offered at 667-
MHz, 800-MHz and 1066-MHz source-synchronous front side
bus (FSB)
• The Penryn processor in ULV are offered at 667-MHz and 800-
MHz source synchronous front side bus (FSB)
• Advanced power management features including Enhanced
Intel SpeedStep® Technology and dynamic FSB frequency
switching
• Digital thermal sensor (DTS)
• Intel® 64 architecture
• Supports enhanced Intel® Virtualization Technology
• Intel® Dynamic Acceleration Technology and Enhanced Multi
Threaded
Item
CPU
Speed
Cores
Bus
Speed
(MHz)
Mfg.
Tech
Cache
Size
Package P/N
P7450 2.13 GHz 2 1066 45 nm 3 MB Micro-FCPGA
P8600 2.4 GHz 2 1066 45 nm 3 MB Micro-FCPGA
P8700 2.53 GHz 2 1066 45 nm 3 MB Micro-FCPGA
P9500 2.53 GHz 2 1066 45 nm 6 MB Micro-FCPGA
T6400 2.0 GHz 2 800 45 nm 3 MB Micro-FCPGA