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Document No. DER-S0008A 20 Version 1.0 ©2008 DMC Co., Ltd.
TSC-30/IC Product S
p
ecification
110
±
20s
175±10 °C 1 to 4 °C/s
220 °C or higher, 50s max.
255 °C or higher, 10s max.
260 °C max.
Time
Package’s surface temperature
200 °C or higher, 70s max.
8. Implementation Temperature Specification
We do not recommend the wave soldering method.
1. Reflow method (Infrared reflow, air reflow)
Frequency: Three times or less
Temperature: The following device surface temperature profile is recommended.
Figure 1: Infrared reflow, air reflow temperature profile
2. Soldering iron (Manual soldering)
Soldering bit’s temperature: 370 °C or lower
Soldering time: Five seconds or less/terminal