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Removal and replacement procedures
Maintenance and Service Guide 4–55
✎
The thermal material must be thoroughly cleaned from the surface of the heat sink assembly and the system board
each time the heat sink assembly is removed. Thermal material is applied to the heat sink to correspond with
components on the system board as follows: the processor
1
, the Northbridge chip
2
, and the capacitors
3
.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare parts.
Reverse this procedure to install the fan/heat sink assembly.