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3. Remove the fan/heat sink assembly (2).
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1) and
the processor (2) each time the fan/heat sink assembly is removed. Thermal pads and thermal paste
must be installed on all surfaces before the fan/heat sink assembly is reinstalled.
The following locations require thermal pads on systems with discrete graphics subsystems:
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(3) Four locations on heat sink
●
(4) Northbridge chip
●
(5) nVidia video chip
●
(6) Capacitors
NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1) and
the processor (2) each time the fan/heat sink assembly is removed. Thermal pads and thermal paste
must be installed on all surfaces before the fan/heat sink assembly is reinstalled.
86 Chapter 4 Removal and replacement procedures