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SED1520 Series
2–4 EPSON
PAD
Pad Arrangement
Chip specifications of AL pad package
Chip size: 4.80×7.04×0.400 mm
Pad pitch: 100×100 µm
Chip specifications of gold bump package
Chip size: 4.80×7.04×0.525 mm
Bump pitch: 199 µm (Min.)
Bump height: 22.5 µm (Typ.)
Bump size: 132×111 µm (±20 µm) for mushroom
model
116×92 µm (±4 µm) for vertical model
Note: An example of SED1520D
AA die numbers is given. These numbers are the same as the bump
package.
100 95 90 85
1
5
10
15
20
25
30
35 40 45 50
55
60
65
70
75
80
D1520D *
AA
X
Y
4.80 mm
7.04 mm
(0, 0)