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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is
used on the processor (1) and the heat sink section (2) that services it. Thermal pads are used on the
Northbridge chip (3) and the section of the heat sink (4) that services it. Replacement thermal material
is included with all fan/heat sink assembly, system board, and processor spare part kits.
The following illustration shows the replacement thermal material locations for computer models
equipped with graphics subsystems with UMA memory.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures 101