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Technical Reference Guide www.hp.com 3-3
Processor/Memory Subsystem
3.2.2 Processor Changing/Upgrading
All models use the LGA775 ZIF (Socket T) mounting socket. These systems require that the
processor use an integrated heatsink/fan assembly. A replacement processor must use the same
type heatsink/fan assembly as the original to ensure proper cooling. The heatsink and attachment
clip are specially designed provide maximum heat transfer from the processor component.
CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment
of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal
conditions and automatically shut down, such a condition could still result in damage to the processor
component. Refer to the applicable Service Reference Guide for processor installation instructions.
Table 3-1 provides a sample listing of processors supported by these systems.
NOTE:
[1] Standard Intel feature set including EM64T, XD, and EIST support. Refer to www.intel.com
for
detailed information.
CAUTION: The USDT form factor can support a processor with a maximum power consumption of 65
watts. The SFF and CMT form factors can support a processor with a maximum power consumption of 95
watts. Exceeding these limits can result in system damage and lost data.
Table 3-1
Supported Processors (partial listing)
Intel
Model
Core
design Features
Clock
Speed
in GHz
FSB
Speed
in MHz
L2
Cache
Form
Factor
support
Q6700 quad VT, [1] 2.66 1066 8 MB SFF, CMT
Q6600 quad VT, [1] 2.40 1066 8 MB SFF, CMT
E6850 dual vPro, VT, TXT, [1] 3.00 1333 4 MB all
E6750 dual vPro, VT, TXT, [1] 2.66 1333 4 MB all
E6550 dual vPro, VT, TXT, [1] 2.33 1333 4 MB all
E4500 dual [1] 2.20 800 2 MB all
E4400 dual [1] 2.00 800 2 MB all
E2180 dual [1] 2.00 800 1 MB all
E2160 dual [1] 1.80 800 1 MB all
440 single [1] 2.00 800 512 KB all