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Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008 TDG
Order Number: 320028-001 10
Thermal Specifications—Core™ 2 Duo Mobile Processors
3.0 Thermal Specifications
3.1 Thermal Design Power
The Thermal Design Power (TDP) specification is listed in Table 2. Heat transfer through the micro-
FCBGA, micro-FCPGA package and socket via the base board is negligible. The cooling capacity
without a thermal solution is also minimal, so Intel requires the use of a heatsink for all usage
conditions.
3.2 Maximum Allowed Component Temperature
The device must maintain a maximum temperature at or below the value specified in Table 2. The
thermal solution is required to meet the temperatures specification while dissipating the Thermal
Design Power.
=
Table 2. Thermal Specifications for the Intel
®
Core™2 Duo processor
CPU Processor SKU# TDP (W)
T
J-MAX
(°C)
T
J-MIN
(°C)
Intel® Core™ 2 Duo
Mobile Processors
on 45-nm process
Standard Voltage (Core 2 Duo-6M, Celeron-2M) 35
105 0Low Voltage (Core 2 Duo -3M) 17
Ultra Low Voltage (Core 2 Duo -2M, Celeron) 10