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Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008 TDG
Order Number: 320028-001 16
Thermal Solution Requirements—Core™ 2 Duo Mobile Processors
5.1.1 Calculating the Required Thermal Performance for the Intel
®
Core™2 Duo processor
Overall thermal performance, Ψ
JA,
is then defined using the thermal characterization parameter:
• Define a target component temperature T
JUNCTION
and corresponding TDP.
• Define a target local ambient temperature, T
A
.
The following provides an illustration of how to determine the appropriate performance targets.
Assume:
•TDP = 35 W and T
JUNCTION
= 105 °C
• Local processor ambient temperature, T
A
= 40 °C.
Using Equation 1, the maximum allowable resistance, junction-to-ambient, is calculated as:
To determine the required heatsink performance, a heatsink solution provider would need to
determine Ψ
CA
performance for the selected TIM and mechanical load configuration. If the heatsink
solution were designed to work with a TIM material performing at Ψ
TIM
≤ 0.50 °C/W, solving from
Equation 2, the performance of the heatsink required is:
Figure 5. Processor Thermal Characterization Parameter Relationships
Equation 3. Maximum Allowable Resistance
Equation 4. Required Performance of the Heatsink
T
S
T
J
T
A
Ψ
SA
Ψ
Ψ
TIM
Device
T
S
T
A
Ψ
SA
Ψ
TIM
Ψ
JA
HEATSINK
WC
TDP
TT
o
AJ
JA
/857.1
35
40105
=
−
=
−
=Ψ
WC
o
JSJASA
/36.150.086.1 =−=Ψ−Ψ=Ψ