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Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008 TDG
Order Number: 320028-001 4
Figures—Core™ 2 Duo Mobile Processors
Figures
1 Thermal Design Process..............................................................................................7
2 Primary Side Keep Out Zone Requirements— Micro-FCPGA ............................................ 12
3 Primary Side Keep Out Zone Requirements— Micro-FCBGA............................................ 13
4 Secondary Side Keep Out Zone Requirements..............................................................14
5 Processor Thermal Characterization Parameter Relationships ......................................... 16
6 AdvancedTCA* Reference Heatsink Assembly............................................................... 18
7 AdvancedTCA* Heatsink Thermal Performance vs. Volumetric Airflow Rate ...................... 19
8 1U Reference Heatsink Assembly ............................................................................... 20
9 1U Heatsink Thermal Performance vs. Volumetric Airflow Rate ....................................... 21
10 CompactPCI Reference Heatsink Assembly ..................................................................21
11 cPCI Reference Heatsink Thermal Performance vs. Volumetric Flow Rate ......................... 22
12 Heatsink Orientation Relative to Airflow Direction ......................................................... 23
13 Measuring TLA with an Active Heatsink ....................................................................... 26
14 Measuring TLA with a Passive Heatsink ....................................................................... 27
15 AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2) ........ 31
16 AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2) ........ 32
17 AdvancedTCA* Reference Heatsink Assembly............................................................... 33
18 AdvancedTCA* Reference Heatsink............................................................................. 34
19 CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2) .......... 35
20 CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2) .......... 36
21 CompactPCI* Reference Heatsink Assembly................................................................. 37
22 CompactPCI* Reference Heatsink............................................................................... 38
23 1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2)................................. 39
24 1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2)................................. 40
25 1U Reference Heatsink Assembly ............................................................................... 41
26 1U Reference Heatsink.............................................................................................. 42
Tables
1 Definition of Terms.....................................................................................................7
2 Thermal Specifications for the Intel
®
Core™2 Duo processor.......................................... 10
3 Required Heatsink Thermal Performance (Ψ
JA
)............................................................. 17
4 Reliability Requirements............................................................................................ 28
5 Reference Heatsink .................................................................................................. 29
6 Mechanical Drawings ................................................................................................ 30