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Core™ 2 Duo Mobile Processors—Reference Thermal Solutions
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG June 2008
21 Order Number: 320028-001
6.5 Compact PCI Reference Heatsink
The cPCI reference thermal solution is shown in Figure 10. The maximum heatsink height is
constrained to 8.7 mm. The heatsink uses the fastener assembly (refer to Section 6.6) to mount to
the PCB. Detailed drawings of this heatsink are provided in Appendix B, “Mechanical Drawings”.
Figure 9. 1U Heatsink Thermal Performance vs. Volumetric Airflow Rate
Figure 10. CompactPCI Reference Heatsink Assembly
1U+ Reference Heatsink Performance
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0 5 10 15 20 25 30
Volumetric Air Flow Rate (CFM)
PSI (C/W)
Psi_ja
Psi_sa