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Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008 TDG
Order Number: 320028-001 18
Reference Thermal Solutions—Core™ 2 Duo Mobile Processors
6.0 Reference Thermal Solutions
Intel has developed reference thermal solutions designed to meet the cooling needs of embedded
form factor applications. This chapter describes the overall requirements for the reference thermal
solution including critical-to-function dimensions, operating environment, and verification criteria.
This document details solutions that are compatible with the AdvancedTCA* and Server System
Infrastructure (1U and larger) form factors.
The data in this section is based on wind tunnel testing of the reference thermal solutions. The
heatsinks were tested as an assembly with a thermal test vehicle (TTV), TIM, socket and test board.
The test assembly is placed in a rectangular duct with no upstream obstructions. Air flow is measured
by means of a calibrated nozzle downstream of the unit under test. The Ψ values shown in the charts
to follow represent the mean resistance values plus the one-sided, 99 percent confidence interval.
6.1 ATCA Reference Thermal Solution
The AdvancedTCA reference thermal solution is shown in Figure 6. The maximum component height
for this form factor is 21.33 mm, so the maximum heatsink height is constrained to 16.27 mm. The
heatsink uses the fastener assembly to mount to the PCB as described in Section 6.6, “Heatsink
Fastener Assembly” . Detailed drawings of this heatsink are provided in Appendix B, “Mechanical
Drawings”.
Figure 6. AdvancedTCA* Reference Heatsink Assembly