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Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007 TMDG
11
Thermal Specifications—Intel
®
6321ESB ICH
3.0 Thermal Specifications
3.1 Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the Intel® 6321ESB I/O
Controller Hub component to consume maximum power dissipation for sustained time
periods. Therefore, in order to arrive at a more realistic power level for thermal design
purposes, Intel characterizes power consumption based on known platform benchmark
applications. The resulting power consumption is referred to as the Thermal Design
Power (TDP). TDP is the target power level that the thermal solutions should be
designed to. TDP is not the maximum power that the chipset can dissipate.
For TDP specifications, see Table 3. Flip chip ball grid array (FC-BGA) packages have
poor heat transfer capability into the board and have minimal thermal capability
without a thermal solution. Intel recommends that system designers plan for a heatsink
when using the Intel® 6321ESB I/O Controller Hub component.
3.2 Die Case Temperature
To ensure proper operation and reliability of the Intel® 6321ESB I/O Controller Hub
component, the die temperatures must be at or between the maximum/minimum
operating temperature ranges as specified in Table 3. System and/or component level
thermal solutions are required to maintain these temperature specifications. Refer to
Chapter 6.0 for guidelines on accurately measuring package die temperatures.
Note: These specifications are based on silicon characterization; however, they may be
updated as further data becomes available.
Table 3. Intel® 6321ESB I/O Controller Hub Thermal Specifications
Parameter Value Notes
Tcase_max 105°C
Tcase_min 5°C
TDP 12.4W