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Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007 TMDG
17
Thermal Metrology—Intel
®
6321ESB ICH
Note: Not to scale.
Figure 6. Thermal Solution Decision Flowchart
Figure 7. Zero Degree Angle Attach Heatsink Modifications
001240
Attach
thermocouples
using recommended
metrology. Setup
the system in the
desired
configuration.
Tdie >
Specification?
No
Yes
Heatsink
Required
Select
Heatsink
End
Start
Run the Power
program and
monitor the
device die
temperature.
Attach device
to board
using normal
reflow
process.