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Intel
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6321ESB ICH—Reliability Guidelines
Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
TMDG February 2007
26
8.0 Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. Some general recommendations are shown in Table 6.
§ §
Table 6. Reliability Guidelines
Test (1) Requirement Pass/Fail Criteria (2)
Mechanical Shock 50 g, board level, 11 msec, 3 shocks/axis Visual Check and Electrical Functional Test
Random Vibration
7.3 g, board level, 45 min/axis, 50 Hz to
2000 Hz
Visual Check and Electrical Functional Test
Temperature Life
85°C, 2000 hours total, checkpoints at
168, 500, 1000, and 2000 hours
Visual Check
Thermal Cycling -5°C to +70°C, 500 cycles Visual Check
Humidity 85% relative humidity, 55°C, 1000 hours Visual Check
Notes:
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies
from three lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.