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Intel
®
6321ESB ICH—Reference Thermal Solution
Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
TMDG February 2007
22
7.5 Torsional Clip Heatsink Thermal Solution Assembly
The reference thermal solution for the Intel
®
6321ESB ICH component is a passive
heatsink with thermal interface. It is attached using a clip with each end hooked
through an anchor soldered to the board. Figure 12 shows the reference thermal
solution assembly and associated components. The torsional clip and the clip retention
anchor are the same as the one used on the Intel® E7500/E7501/E7505 and 3100
chipset reference thermal solutions.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in Appendix B, “Mechanical Drawings”. Appendix A, “Thermal Solution
Component Suppliers” contains vendor information for each thermal solution
component.