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Intel
®
6321ESB ICH—Reference Thermal Solution
Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
TMDG February 2007
20
7.3 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the Intel
®
6321ESB ICH thermal solution are shown in Figure 10.
When using heatsinks that extend beyond the Intel® 6321ESB I/O Controller Hub
reference heatsink envelope shown in Figure 10, any motherboard components placed
between the heatsink and motherboard cannot exceed 2.46 mm (0.10 in.) in height.
Figure 9. Torsional Clip Heatsink Measured Thermal Performance Versus Approach
Velocity and Target at 65C Local-Ambient
0.000
1.000
2.000
3.000
4.000
5.000
6.000
7.000
8.000
0 50 100 150 200 250 300 350 400
LFM through fin area
Psi-ca (mean plus 2.3 sigma) [C/W]
Thermal Target
Simulation results with
EOLife TIM performance