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Thermal Management Support
• Digital Thermal Sensor
• Adaptive Thermal Monitor
• THERMTRIP# and PROCHOT# support
• On-Demand Mode
• Memory Open and Closed Loop Throttling
• Memory Thermal Throttling
• External Thermal Sensor (TS-on-DIMM and TS-on-Board)
• Render Thermal Throttling
• Fan speed control with DTS
Package Support
The processor socket type is noted as LGA1150. The package is a 37.5 x 37.5 mm Flip
Chip Land Grid Array (FCLGA 1150). See the appropriate Processor Thermal
Mechanical Design Guidelines and LGA1150 Socket Application Guide for complete
details on the package.
Terminology
Table 1. Terminology
Term Description
APD Active Power-down
B/D/F Bus/Device/Function
BGA Ball Grid Array
BLC Backlight Compensation
BLT Block Level Transfer
BPP Bits per pixel
CKE Clock Enable
CLTM Closed Loop Thermal Management
DDI Digital Display Interface
DDR3 Third-generation Double Data Rate SDRAM memory technology
DLL Delay-Locked Loop
DMA Direct Memory Access
DMI Direct Media Interface
DP DisplayPort*
DTS Digital Thermal Sensor
DVI*
Digital Visual Interface. DVI* is the interface specified by the DDWG (Digital Display
Working Group)
EC Embedded Controller
continued...
1.4
1.5
1.6
Introduction—Processor
Desktop 4th Generation Intel
®
Core
™
Processor Family, Desktop Intel
®
Pentium
®
Processor Family, and Desktop Intel
®
Celeron
®
Processor Family
December 2013 Datasheet – Volume 1 of 2
Order No.: 328897-004 13