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Getting Started
316704-001 / Development Kit User’s Manual 15
2 Getting Started
This chapter identifies the development kit’s key components, features and
specifications. It also details basic development board setup and operation.
2.1 Overview
The development board consists of a baseboard populated with the Intel
®
Core
TM
2
Duo processor, the Mobile Intel
®
GME965 Express Chipset, other system board
components and peripheral connectors.
Note: The development board is shipped as an open system allowing for maximum flexibility
in changing hardware configuration and peripherals. Since the board is not in a
protective chassis, take extra precaution when handling and operating the system.
2.1.1 Development Board Features
Features of the development board are summarized in Table 6.
Table 6. Development Board feature Set Summary
Development Board
Implementation
Comments
Processor
Intel
®
Core
TM
2 Duo processor with
4 MByte L2 Cache on 65nm process
FSB 533/667/800 MHz support
478 pin Flip Chip Pin Grid Array (Micro-
FCPGA) package
Mobile Intel
®
GME965 Express
Chipset (GMCH)
1299-pin Micro-FCBGA Package
Chipset
Intel
®
I/O Controller Hub 8-M
Enhanced (ICH8M-E)
676-pin BGA Package
Memory
Two DDR2 RAM SO-DIMM slots. Maximum 4GB of DDR2 Memory (RAM)
using 1Gb technology and stacked SO-
DIMMs.
Supports DDR2 frequency of 533 or
667MHz
Video
One PCI Express* Graphics Slot
One dual channel LVDS Connector
One VGA Connector
One TV D-Connector supporting S-
Video, Composite video and
Component video
The Mobile Intel
®
GME965 Express Chipset
(GMCH) has 2 video pipes which allows
support of dual independent display.
18-bpp and 24-bpp LVDS panel support
Support for two SDVO channels via x16
PCIe connector (through ADD2 or MEC
cards)
F
E
A
T
U
R
E
PCI One 5V PCI slot PCI revision 2.3 compliant (33MHz)