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Hardware Reference
316704-001 / Development Kit User’s Manual 49
Reference
Designator
Slot/Socket Description Detail
J6H5 Front Panel Header Table 28
J6H3, J6H4 USB Header Table 29
4.6.2.1 478 Pin Grid Array (Micro-FCPGA) Socket
The pin locking mechanism on the CPU socket is released by rotating the screw on the
socket 180 degrees counter-clockwise. CPU pins are keyed so as to only allow
insertion in one orientation. DO NOT FORCE CPU into socket. Once the CPU is properly
seated into the socket, turn the screw 180 degrees clock-wise to secure the CPU in the
socket. Note that the slot on the screw aligns with the lock and unlock legend on the
case of the CPU socket.
Caution: Please refer to the heatsink installation instructions in Appendix A prior to inserting
the heatsink as the CPU and socket can be easily damaged.
Caution: Only insert Intel
®
Core
TM
2 Duo Mobile processors that are intended for operation
with the Mobile Intel
®
965 Express Chipset Family into the development board.
These processors have a pinout known as Socket-P. Earlier Intel
®
Core
TM
2 Duo
Mobile processors that have a pinout known as Socket-M are mechanically
compatible with the processor socket but not electrically compatible. Insertion of
these processors will cause damage to the processor and the development board.
4.6.2.2 PCI Express* (x16)
The development board has one x16 lane PCI Express* Graphics slot and supports
either x1, x2, x4, x8 or x16 modes. The slot is wired “lane reversed” which connects
the Mobile Intel
®
GME965 Express Chipset lanes 0 through 15 to lanes 15 through 0
on the slot. The Mobile Intel
®
GME965 Express Chipset will internally un-reverse this
wiring since its CFG9 power-on strap is tied low.
Table 18. PCI Express* (x16) Pinout (J6B2)
Pin Description Pin Description
A1 PRSNT1# B1 +12V
A2 +12V B2 +12V
A3 +12V B3 +12V
A4 GND B4 GND
A5 JTAG2 (TCK) B5 SMCLK
A6 JTAG3 (TDI) B6 SMDAT
A7 JTAG4 (TDO) B7 GND
A8 JTAG5 (TMS) B8 +3.3V
A9 +3.3V B9 JTAG1 (TRST#)
A10 +3.3V B10 +3.3VAUX