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316704-001 / Development Kit User’s Manual 9
Term/Acronym Definition
manufacturer’s conditions required for AC timing specifications; i.e.,
ringback, etc.) and the output pin of the driving agent crossing the
switching voltage when the driver is driving a test load used to specify the
driver’s AC timings.
Maximum and Minimum Flight Time - Flight time variations are caused by
many different parameters. The more obvious causes include variation of
the board dielectric constant, changes in load condition, crosstalk, power
noise, variation in termination resistance, and differences in I/O buffer
performance as a function of temperature, voltage, and manufacturing
process. Some less obvious causes include effects of Simultaneous
Switching Output (SSO) and packaging effects.
Maximum flight time is the largest acceptable flight time a network will
experience under all conditions.
Minimum flight time is the smallest acceptable flight time a network will
experience under all conditions.
Infrared Data
Assoc.
The Infrared Data Association (IrDA) has outlined a specification for serial
communication between two devices via a bi-directional infrared data
port. The development board has such a port and it is located on the rear
of the platform between the two USB connectors.
IMVP6+ The Intel Mobile Voltage Positioning specification for the Intel® Core™ 2
Duo Processor. It is a DC-DC converter module that supplies the required
voltage and current to a single processor.
Inter-Symbol
Interference
Inter-symbol interference is the effect of a previous signal (or transition)
on the interconnect delay. For example, when a signal is transmitted down
a line and the reflections due to the transition have not completely
dissipated, the following data transition launched onto the bus is affected.
ISI is dependent upon frequency, time delay of the line, and the reflection
coefficient at the driver and receiver. ISI may impact both timing and
signal integrity.
Media Expansion
Card
The Media Expansion Card (MEC) provides digital display options through
the SDVO interface. The MEC card also incorporates video-in via a x1 PCI
Express* port.
Network The network is the trace of a Printed Circuit Board (PCB) that completes
an electrical connection between two or more components.
Overshoot The maximum voltage observed for a signal at the device pad, measured
with respect to VCC.
Pad The electrical contact point of a semiconductor die to the package
substrate. A pad is only observable in simulations.
Pin The contact point of a component package to the traces on a substrate,
such as the motherboard. Signal quality and timings may be measured at
the pin.
Power-Good “Power-Good,” “PWRGOOD,” or “CPUPWRGOOD” (an active high signal)
indicates that all of the system power supplies and clocks are stable.
PWRGOOD should go active at a predetermined time after system
voltages are stable and should go inactive as soon as any of these
voltages fail their specifications.
Ringback The voltage to which a signal changes after reaching its maximum
absolute value. Ringback may be caused by reflections, driver oscillations,
or other transmission line phenomena.