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TFX12V Power Supply Design Guide
Thin Form Factor with 12 V Connector
Version 2.0
40
7 System Cooling Considerations
The power supply fan location allows the system designer to utilize the airflow to help cool critical components
such as the processor and chipset. Please note that the fan pulls air from the system, instead of blowing hot
air in, so components must be placed such that airflow is directed across critical components. Cables, etc
must not impede airflow.
For more information on system thermal design, please refer to http://www.formfactors.org/
.
8 Reliability
The de-rating process promotes quality and high reliability. All electronic components should be designed
with conservative device d-ratings for use in commercial and industrial environments.
9 Applicable Documents
The following documents support this design guide as additional reference material.
Document Title Description
FCC Rules Part 15, Class B Title 47, Code of Federal Regulations, Part 15
ICES-003: 1997, Class B Interference-Causing Equipment Standard – Digital Apparatus
EN 55022: 1998 +
Amendment A1:2000 Class B
Information Technology Equipment – Radio disturbance characteristics –
Limits and methods of measurement
CISPR 22: 1997, Class B
Information Technology Equipment – Radio disturbance characteristics –
Limits and methods of measurement
AS/NZS 3548:1995, Class B
Information Technology Equipment – Radio disturbance characteristics –
Limits and methods of measurement
EN 55024:1998
Information Technology Equipment – Immunity Characteristics – Limits and
methods of measurement
IEC 60950, 3
rd
ed., 1999 Safety of Information Technology Equipment
EN 60950: 2000 Safety of Information Technology Equipment
UL 60950, 3
rd
ed., 2000 Safety of Information Technology Equipment
CSA 22.2 No. 60950-00 Safety of Information Technology Equipment