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1996 Dec 12 15
Philips Semiconductors Product specification
Smart card interface TDA8001
I
IH
HIGH level input current V
IH
= 5V −−10 µA
Reset output to the card (RST)
V
IDLE
output voltage in IDLE −−0.4 V
V
OL
LOW level output voltage I
OL
= 200 µA −−0.45 V
V
OH
HIGH level output voltage I
OH
=−200 µA 4.3 − V
CC
V
I
OH
=−10 µAV
CC
− 0.7 − V
CC
V
t
RST
delay between RSTIN and RST RST enabled; see Fig.7 −−2µs
Clock output to the card (CLK)
V
IDLE
output voltage in IDLE −−0.4 V
V
OL
LOW level output voltage I
OL
= 200 µA −−0.4 V
V
OH
HIGH level output voltage I
OH
=−200 µA 2.4 − V
CC
V
I
OH
=−20 µA 0.7V
CC
− V
CC
V
I
OH
=−10 µAV
CC
− 0.7 − V
CC
V
t
r
rise time C
L
= 30 pF; note 2 −−14 ns
t
f
fall time C
L
= 30 pF; note 2 −−14 ns
δ duty factor C
L
= 30 pF; note 2 45 − 55 %
Card programming voltage (V
PP
)
V
PP
output voltage idle mode −−0.4 V
read mode V
CC
− 4% − V
CC
+ 4% V
write mode; I
PP
<50mA P−2.5%
(3)
− P + 2.5%
(3)
V
∆I
PP
/∆t < 40 mA/100 ns;
note 4
P − 2.5%
(3)
− P + 2.5%
(3)
V
I
PP
output current active; from 0 to P
(3)
−−−50 mA
V
PP
shorted to GND −−−100 mA
SR slew rate up or down 0.3 0.4 0.5 V/µs
High voltage input (V
H
)
V
H
input voltage −−30 V
I
H
input current at V
H
idle mode; active mode;
unloaded
4 − 6mA
P=5V 5 − 9mA
P = 12.5 V 6.5 − 10.5 mA
P=15V 7 − 11 mA
P=21V 8 − 12 mA
V
H
−V
PP
voltage drop −−2.2 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT