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SUPERSERVER 5010H/5010E Manual
1-4
1-3 Mainboard Features
At the heart of the SuperServer 5010H/5010E lies the 370SSR+/370SSE+, a
single processor motherboard designed to provide maximum performance.
Below are the main features of the 370SSR+/370SSE+.
Chipset Overview
Intel’s 815E chipset is made up of three main components: the Graphics and
Memory Controller Hub (GMCH), the I/O Controller Hub (ICH) and the Firm-
ware Hub (FWH). The GMCH integrates a 133/100/66 MHz system bus
controller, a 2D/3D graphics accelerator (AGP2x/4x) discrete graphics card,
a 133/100 MHz SDRAM controller and a high-speed hub architecture inter-
face that communicates with the ICH. The ICH integrates a UDMA/100 con-
troller, USB controllers and other I/O functions (see below). The FWH
stores both system and video BIOS and includes a Random Number Genera-
tor (RNG).
Graphics and Memory Controller Hub (GMCH)
The GMCH includes the host (CPU) interface, DRAM interface, ICH2 inter-
face and 4xAGP interface for the 815E chipset. It contains advanced power
management logic and supports dual channels for DRAM. The AGP 2.0
interface supports 4x data transfers and operates at a peak bandwidth of
1066 MB/sec. The MCH host interface bus runs at 133/100/66 MHz.
I/O Controller Hub (ICH2)
The ICH2 is the I/O Controller Hub subsystem on the 370SSR+/370SSE+,
which integrates many of the Input/Output functions of the 815E chipset,
including UDMA/100 Bus Master IDE controllers. It also provides the inter-
face to the PCI Bus and communicates with the MCH over a dedicated hub
interface. In addition to the UDMA/100 Bus Master IDE controllers, this
powerful ICH2 also includes two USB controllers that offer 24 Mbps of
bandwidth across three ports. ICH2 also features an enhanced AC'97
interface that supports full surround sound for the Dolby Digital Audio used
on DVDs.
Firmware Hub (FWH)
The FWH is a component that brings added security and manageability to
the PC platform infrastructure. This device includes an integrated Random