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Chapter 1 23
LAN Interface
Hardware Monitor Function
Item Description
Chip Intel 82566
Feature • 81-pin, 1.0 mm pitch, 10 mm x 10 mm FCMMAP (BGA) package
• IEEE 802.3ab compliant
• Robust end to end connections over various cable length
• Full duplex at 10/100/1000Mbps and half duplex at 10 or 100Mbps
• IEEE 802.3ab auto-negotiation with next page support
• 10/100 downshift: automatic link speed adjustment with poor quality
cable
• Automatic MDI crossover
• Advanced cable diagnostics
• Footprint compatible with 82562V devices for a single-board dual design
(Gigabit and 10/100)
• LCI interface for a very low power 10/100 link
• Gigabit LAN connect interface: low pin count, high speed interface with
special low power idle modes and allows PHY placement proximity to I/O
back panel
• Three LED outputs
• Clock supplied to MAC
• Full chip power down: lowest power state support
• Power consumption less than 1.16W
Item Description
Feature • Smart fan control system, Thermal Cruise and Speed Cruise support
• Six VID input pins for CPU Vcore identification
• Two thermal inputs from optionally remote thermistors or 2N3904
transistors or Pentium 4 thermal diode output
• Four external voltage detect inputs
• Three intrinsic voltage monitoring (typical for Vbat, +5VSB, +5CC)
• Two fan speed monitoring inputs
• Two fan speed control (DC analog output)
• WATCHDOG comparison of all monitored items
• Overheat indication output
• Issue SMI#, IRQ, OVT# to activate system protection