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PC 6170 User’s Manual
A.3 Advanced Chipset Features
Since
the features in
this section
are related to
the chipset on the
CPU
board and are completely optimized, you are
not
recommended
to change
the
default settings
in this setup table unless you
are
well
oriented with the
chipset
features.
CMOS Setup
Utility-Copyright © 1984-2001
Aw
ard
Softw
are
Ad
vanced Chipset
Featu
res
DRAM
Timing
By
SPD
Ite
m
He
lp
CA
Ss
Latency
Ti
me
2.5
Acti
ve to
Re
charge De
lay
7
Menu
Level
f
D
RAM
RA
S
#
to
CA
S#
De
l
a
y
3
DRAM
RAS#
Re
charge
3
D
RAM
Data
In
te
g
r
ity Mo
de
No
n
-E
CC
MGM Co
re
Fr
eq
uency
Au
to
Max 400/333MHz
System B
IOS
C
acheable
Enable
Video
BIOS
Ca
cheable
Di
sabled
Memory Ho
le At
15
M-16M
Di
sabled
Delayed Transacti
on
Di
sabled
Delay Prior
to Thermal
16
Min
AGP Aperture S
i
ze
(M
B)
64
In
it Di
splay
Fi
rst
Onboard
** On-Chip VGA
Se
tting **
On-Chip VG
A
Enabled
On-Chip Frame Bu
ffe
r Size
32
MB
Boot Displ
ay
Au
to
Pane
l Scaling
Au
to
Panel Number
640 x480
ÇÈ
ÆÅ
:
Mo
ve
E
n
te
r:
S
e
le
ct
+/-
/
P
U
/P
D
:
Va
lu
e
F
1
0
:
S
a
ve
E
S
C
:
E
xi
t
F
1
:
Gene
ral He
lp
F
5
:
P
r
evious
Values F6: Fail-
Saf
e
D
e
f
a
ults F7: O
p
timize
d D
e
f
a
ults
SDRAM
CAS latency Time
You can select CAS latency time in
HCLKs
2, 3, or Auto.
The board
designer should set the values in this field, depending on the DRAM
installed.
Do not change
the
values
in this field unless
you change
specifications of
the
installed
DRAM or the installed CPU.
DRAM Data Integrity Mode
This option sets the data integrity mode of the DRAM installed in the
system.
The default setting
is
“
Non-ECC
”
.
SBC83810 BIOS
Setup
45