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ROG Maximus Formula (Special Edition) / Maximus Formula 1-7
Fanless Design–Heat-pipe
The ASUS fanless design allows multi-directional heat ow from major
thermal sources in the motherboard to lower overall system temperature,
resulting in quieter operation and longer system life. ASUS has devoted
special efforts to address the thermal issues across the motherboard, and
most notably in the following areas: CPU, power, VGA, Northbridge and
Southbridge. The heat pipe, heatsink, and strategic board layout were tailor
made to dissipate heat in the most efcient manner.
Fanless Design–Stack Cool 2
ASUS Stack Cool 2 is a fan-less and zero-noise cooling solution that lowers
the temperature of critical heat generating components. The motherboard
uses a special design on the printed circuit board (PCB) to dissipate heat
these critical components generate.
1.3.4 ASUS special features
AI Gear 3
With a manual or automatic mode, AI Gear 3 allows users to choose from
four proles to adjust CPU frequency and vCore voltage—“Turbo Mode,”
“High Performance Mode,” “Medium Power Saving Mode,” and “Max Power
Saving Mode.” As a digital solution, AI Gear 3 is very precise and can
automatically detect current CPU loading, dynamically overclocking the CPU
speed in real time and lowering the voltage for power saving during light
loading. With this power saving mode, users can make real-time changes in
the operating system and can save up to 62% CPU power in light loading.
See page 5-29 for details.
AI Nap
With AI Nap, the system can continue running at minimum power and noise
when you are temporarily away. To wake the system and return to the OS
environment, simply click the mouse or press a key. See page 5-30 for
details.
ASUS Q-Fan 2
ASUS Q-Fan 2 technology intelligently adjusts both CPU fan and chassis fan
speeds according to system loading to ensure quiet, cool and efcient operation.
See pages 4-31, 4-32, and 5-31 for details.