1-41-4
1-41-4
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Chapter 1: Product introductionChapter 1: Product introduction
Chapter 1: Product introductionChapter 1: Product introduction
Chapter 1: Product introduction
1.3.21.3.2
1.3.21.3.2
1.3.2
Innovative ASUS featuresInnovative ASUS features
Innovative ASUS featuresInnovative ASUS features
Innovative ASUS features
CrashFree BIOS 2 CrashFree BIOS 2
CrashFree BIOS 2 CrashFree BIOS 2
CrashFree BIOS 2
This feature allows you to restore the original BIOS data from the support CD
in case when the BIOS codes and data are corrupted. This protection
eliminates the need to buy a replacement ROM chip. See details on page 2-6.
ASUS MyLogo™ ASUS MyLogo™
ASUS MyLogo™ ASUS MyLogo™
ASUS MyLogo™
This feature present in the motherboard allows you to personalize and add
style to your system with customizable boot logos. See page 2-34.
ASUS EZ Flash BIOS ASUS EZ Flash BIOS
ASUS EZ Flash BIOS ASUS EZ Flash BIOS
ASUS EZ Flash BIOS
With the ASUS EZ Flash, you can easily update the system BIOS even
before loading the operating system. No need to use a DOS-based utility or
boot from a floppy disk. See page 2-3 for details.
C.P.R. (CPU Parameter Recall) C.P.R. (CPU Parameter Recall)
C.P.R. (CPU Parameter Recall) C.P.R. (CPU Parameter Recall)
C.P.R. (CPU Parameter Recall)
The C.P.R. feature of the motherboard BIOS allows automatic re-setting to
the BIOS default settings in case the system hangs due to overclocking.
When the system hangs due to overclocking, C.P.R. eliminates the need to
open the system chassis and clear the RTC data. Simply shut down and
reboot the system, and BIOS automatically restores the CPU’s previous
setting for each parameter.
AGP 8X support AGP 8X support
AGP 8X support AGP 8X support
AGP 8X support
The AGP 8X (AGP 3.0) VGA interface specification enables enhanced
graphics performance with high bandwidth speeds up to 2.12 GB/s.
USB 2.0 technology USB 2.0 technology
USB 2.0 technology USB 2.0 technology
USB 2.0 technology
The motherboard implements the Universal Serial Bus (USB) 2.0
specification, dramatically increasing the connection speed from the
12 Mbps bandwidth on USB 1.1 to a fast 480 Mbps on USB 2.0. USB 2.0 is
backward compatible with USB 1.1. See page 1-24 for details.
Temperature, fan, and voltage monitoringTemperature, fan, and voltage monitoring
Temperature, fan, and voltage monitoringTemperature, fan, and voltage monitoring
Temperature, fan, and voltage monitoring
The CPU temperature is monitored by the ASIC (integrated in the Winbond
Super I/O) to prevent overheating and damage. The system fan rotations
per minute (RPM) is monitored for timely failure detection. The ASIC
monitors the voltage levels to ensure stable supply of current for critical
components. See page 2-32 for details.