ASUS P5WD2 PremiumASUS P5WD2 Premium
ASUS P5WD2 PremiumASUS P5WD2 Premium
ASUS P5WD2 Premium
1-71-7
1-71-7
1-7
1.3.31.3.3
1.3.31.3.3
1.3.3
Innovative ASUS featuresInnovative ASUS features
Innovative ASUS featuresInnovative ASUS features
Innovative ASUS features
Native DDR2-800 memory support Native DDR2-800 memory support
Native DDR2-800 memory support Native DDR2-800 memory support
Native DDR2-800 memory support
Native DDR2-800 eliminates the bottleneck when overclocking both the
CPU and the memory, thus maximizing performance for 3D graphics and
other system-intensive applications. See page 4-20 for details.
AI NOS™ (Non-Delay Overclocking System) AI NOS™ (Non-Delay Overclocking System)
AI NOS™ (Non-Delay Overclocking System) AI NOS™ (Non-Delay Overclocking System)
AI NOS™ (Non-Delay Overclocking System)
ASUS Non-delay Overclocking System™ (NOS) is a technology that
auto-detects the CPU loading and dynamically overclocks the CPU speed
only when needed. See page 4-22 for details.
AI NET2 AI NET2
AI NET2 AI NET2
AI NET2
AI NET2 is a BIOS-based diagnostic tool that detects and reports Ethernet
cable faults and shorts. With this utility, you can easily monitor the
condition of the Ethernet cable connected to the LAN (RJ-45) port. During
the bootup process, AI NET2 immediately diagnoses the LAN cable and
reports shorts and faults up to 100 meters at 1 meter accuracy. See pages
4-23 and 5-10 for details.
Fanless Design Fanless Design
Fanless Design Fanless Design
Fanless Design
The ASUS fanless design allows multi-directional heat flow from major
thermal sources in the motherboard to lower overall system temperature,
resulting in quieter operation and longer system life.
ASUS Stack Cool 2 ASUS Stack Cool 2
ASUS Stack Cool 2 ASUS Stack Cool 2
ASUS Stack Cool 2
ASUS Stack Cool 2 is a fan-less and zero-noise cooling solution that lowers
the temperature of critical heat generating components by 20ºC. The
motherboard uses a special design on the printed circuit board (PCB) to
dissipate heat that critical components generate. See page 2-3 for details.